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XCZU3CG-1SFVC784I

  • XCZU3CG-1SFVC784I
  • XCZU3CG-1SFVC784I

XCZU3CG-1SFVC784I

XCZU3CG-1SFVC784I

Xilinx Inc.

-40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 252 I/O

SOT-23

XCZU3CG-1SFVC784I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Package / Case 784-BFBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Bulk
Series Zynq® UltraScale+™ MPSoC CG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 252
Speed 500MHz, 1.2GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $465.40000 $465.4
XCZU3CG-1SFVC784I Product Details

XCZU3CG-1SFVC784I Description


XCZU3CG-1SFVC784I developed by belongs to the family of Xilinx Inc. Zynq® UltraScale+™ MPSoC based on the Xilinx® UltraScale™ MPSoC architecture. It integrates a variety of instruction set processors on a single chip to complete complex and complete functions and has great prospects in application fields such as image processing, network multimedia, and embedded systems. 



XCZU3CG-1SFVC784I Features


On-chip voltage and temperature sensing

Supports LVCMOS, LVDS, and SSTL

Extendable cache coherency

Xilinx® UltraScale™ MPSoC architecture

A variety of instruction set processors



XCZU3CG-1SFVC784I Applications


Mobile communications

Embedded multimedia


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