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XCZU4EG-1FBVB900I

XCZU4EG-1FBVB900I

XCZU4EG-1FBVB900I

Xilinx Inc.

-40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O

SOT-23

XCZU4EG-1FBVB900I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 204
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1,502.80000 $1
XCZU4EG-1FBVB900I Product Details

XCZU4EG-1FBVB900I Description


The Zynq® UltraScale+™ MPSoC XCZU4EG-1FBBB900I is based on the Xilinx® UltraScale™ MPSoC architecture. This XCZU4EG-1FBVB900I integrates a feature-rich 64-bit quad-core or dual-core Arm® Cortex®-A53 and dual-core Arm Cortex-R5F based processing system (PS) and Xilinx programmable logic (PL) UltraScale architecture in a single device. Also included are on-chip memory, multiport external memory interfaces, and a rich set of peripheral connectivity interfaces.



XCZU4EG-1FBVB900I Features


Arm Cortex-A53 Based Application Processing Unit (APU)

Dual-core Arm Cortex-R5F Based Real-Time Processing Unit (RPU)

On-Chip Memory

Arm Mali-400 Based GPU

External Memory Interfaces

8-Channel DMA Controller



XCZU4EG-1FBVB900I Applications


Automotive: Driver assistance, driver information, and infotainment

Wireless Communications: Support for multiple spectral bands and smart antennas

Wired Communications: Multiple wired communications standards and context-aware network services

Data Centers: Software Defined Networks (SDN), data pre-processing, and analytics

Smarter Vision: Evolving video-processing algorithms, object detection, and analytics

Connected Control/M2M: Flexible/adaptable manufacturing, factory throughput, quality, and safety


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