0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O
SOT-23
XCZU6EG-1FFVC900E Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Package / Case
900-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Zynq® UltraScale+™ MPSoC EG
Published
2016
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
204
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1,949.55000
$1
XCZU6EG-1FFVC900E Product Details
XCZU6EG-1FFVC900E Description
XCZU6EG-1FFVC900E core processor(s) are used in the construction of this SoC.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer. As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users. In terms of internal architecture, this SoC design uses the MCU, FPGA method. In the Zynq? UltraScale+? MPSoC EG series, this system on chip SoC is included. It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.This SoC security combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells and that is something to note. It comes in a state-of-the-art Tray package. This SoC part has a total of 204 I/Os.
XCZU6EG-1FFVC900E Features
Reliable performance
256KB RAM. Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU6EG-1FFVC900E System On Chip (SoC) applications.