This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 1156-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq® UltraScale+™ MPSoC EG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq®UltraScale+™ FPGA, 469K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 328 I/Os.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.

256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.

XCZU6EG-3FFVB1156E System On Chip (SoC) applications.

• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics
• Central alarm system
• Smart appliances