XE216-256-FB236-C20

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Manufacturer part number:XE216-256-FB236-C20

Manufacturer:XMOS

Description:ROMless XCore 32-Bit 16-Core Microcontroller XE Series 236 Pin 500MHz 236-LFBGA

Case Package:SOT-23

Datasheet:XE216-256-FB236-C20 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Mounting Type	Surface Mount
Package / Case	236-LFBGA
Number of Pins	236
Supplier Device Package	236-FBGA (10x10)
Operating Temperature	0°C~70°C TA
Packaging	Tray
Series	XE
Published	2015
Part Status	Discontinued
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	70°C
Min Operating Temperature	0°C
Frequency	500MHz
Interface	USB
Max Supply Voltage	1.05V
Min Supply Voltage	950mV
Memory Size	256kB
Oscillator Type	External
Number of I/O	73
Speed	2000MIPS
RAM Size	256K x 8
Memory Type	ROMless
Voltage - Supply (Vcc/Vdd)	0.95V~3.6V
Core Processor	XCore
Program Memory Type	ROMless
Core Size	32-Bit 16-Core
Connectivity	RGMII, USB
Core Architecture	XCore
REACH SVHC	Unknown
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
1	$15.58000	$15.58
25	$11.98000	$299.5
100	$10.74000	$1074
250	$10.39000	$2597.5

XE216-256-FB236-C20 Overview

236-LFBGA-packages are available. There are 73 I/O ports on this device. Device mounting type Surface Mount is the type of mounting that the Microcontroller uses. There is a 32-Bit 16-Core core at the core of this MCU. There is a type of program memory called ROMless in the Microcontroller. There is a temperature range of 0°C~70°C TA for this Microcontroller. An electrical component of this type belongs to the XE series. XCore Core processors are used in MCU. The part has a memory size of 256kB. This device is extremely efficient when operated at a frequency of 500MHz. In this chip, 236 pins can be accessed. There is ROMless memory in this equipment. As a result of its XCore core architecture, it can be used in many applications.