ROMless XCore 32-Bit 16-Core Microcontroller XE Series 236 Pin 236-LFBGA
SOT-23
XE216-512-FB236-I20 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
236-LFBGA
Number of Pins
236
Supplier Device Package
236-FBGA (10x10)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
XE
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Interface
USB
Oscillator Type
External
Number of I/O
73
Speed
2000MIPS
RAM Size
512K x 8
Memory Type
ROMless
Voltage - Supply (Vcc/Vdd)
0.95V~3.6V
Core Processor
XCore
Program Memory Type
ROMless
Core Size
32-Bit 16-Core
Connectivity
RGMII, USB
Core Architecture
XCore
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
168
$14.94298
$2510.42064
XE216-512-FB236-I20 Product Details
XE216-512-FB236-I20 Overview
There is a 236-LFBGA package available. The board has 73 I/Os. Using the Mounting Type Surface Mount, the MCU is mounted on PCB. A 32-Bit 16-Core core is used in order to power the IC chip. The type of memory it uses for its program is ROMless. -40°C~85°C TA is the temperature range at which this Microcontroller operates. XE-series components are electrical components. Powered by a XCore Core processor. On the chip, there are 236 pins that can be accessed. ROMless memory is one of the features of this equipment. The CPU is based on XCore cores.
XE216-512-FB236-I20 Features
236-LFBGA package Mounting type of Surface Mount Minimum temperature of -40°C
XE216-512-FB236-I20 Applications
There are a lot of XMOS XE216-512-FB236-I20 Microcontroller applications.