XE232-1024-FB374-I40

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Manufacturer part number:XE232-1024-FB374-I40

Manufacturer:XMOS

Description:ROMless XCore 32-Bit 32-Core Microcontroller XE Series 374 Pin 374-LFBGA

Case Package:SOT-23

Datasheet:XE232-1024-FB374-I40 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	12 Weeks
Mounting Type	Surface Mount
Package / Case	374-LFBGA
Number of Pins	374
Supplier Device Package	374-FBGA (18x18)
Operating Temperature	-40°C~85°C TA
Packaging	Tray
Series	XE
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	85°C
Min Operating Temperature	-40°C
Interface	USB
Oscillator Type	External
Number of I/O	176
Speed	4000MIPS
RAM Size	1M x 8
Memory Type	ROMless
Voltage - Supply (Vcc/Vdd)	0.95V~3.6V
Core Processor	XCore
Program Memory Type	ROMless
Core Size	32-Bit 32-Core
Connectivity	RGMII, USB
Core Architecture	XCore
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
84	$28.16905	$2366.2002

XE232-1024-FB374-I40 Overview

The package is 374-LFBGA-shaped. There are 176 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 32-Bit 32-Core core architecture. The type of program memory it uses is ROMless. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. It is part of the XE series of electrical components. A XCore Core Processor is at the core of this Microcontroller. On the chip, 374 pins are accessible. There is ROMless memory on this piece of equipment. In addition, it comes with a XCore core architecture.