2MB 2M x 8 FLASH XCore 32-Bit 16-Core Microcontroller XEF Series 236 Pin 236-LFBGA
SOT-23
XEF216-512-FB236-I20 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
236-LFBGA
Number of Pins
236
Supplier Device Package
236-FBGA (10x10)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
XEF
Published
2016
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Interface
USB
Memory Size
2MB
Oscillator Type
External
Number of I/O
73
Speed
2000MIPS
RAM Size
512K x 8
Memory Type
FLASH
Voltage - Supply (Vcc/Vdd)
0.95V~3.6V
Core Processor
XCore
Program Memory Type
FLASH
Core Size
32-Bit 16-Core
Program Memory Size
2MB 2M x 8
Connectivity
RGMII, USB
Core Architecture
XCore
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
168
$16.49000
$2770.32
XEF216-512-FB236-I20 Product Details
XEF216-512-FB236-I20 Overview
The package has a 236-LFBGA shape. With 73 I/Os, it's pretty good. The Microcontroller's mounting type is Surface Mount and this IC chip has the following features. As the name implies, this Microcontroller is based on the 32-Bit 16-Core core. As far as its program memory type is concerned, it is FLASH. Temperatures within -40°C~85°C TA range are measured by this Microcontroller. The XEF series is comprised of this electrical component. The electronic part has a program memory size of 2MB 2M x 8. There's a XCore Core Processor inside. Its memory size is 2MB. It is possible to access the 236 pins on the chip. The equipment on this page features FLASH memory technology. This device features a XCore core architecture.
XEF216-512-FB236-I20 Features
236-LFBGA package Mounting type of Surface Mount Minimum temperature of -40°C
XEF216-512-FB236-I20 Applications
There are a lot of XMOS XEF216-512-FB236-I20 Microcontroller applications.