XL208-128-FB236-C10

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Manufacturer part number:XL208-128-FB236-C10

Manufacturer:XMOS

Description:ROMless XCore 32-Bit 8-Core Microcontroller XL Series 236 Pin 236-LFBGA

Case Package:SOT-23

Datasheet:XL208-128-FB236-C10 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	12 Weeks
Mounting Type	Surface Mount
Package / Case	236-LFBGA
Number of Pins	236
Supplier Device Package	236-FBGA (10x10)
Operating Temperature	0°C~70°C TA
Packaging	Tray
Series	XL
Published	2015
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	70°C
Min Operating Temperature	0°C
Oscillator Type	External
Number of I/O	128
Speed	1000MIPS
RAM Size	128K x 8
Memory Type	ROMless
Voltage - Supply (Vcc/Vdd)	0.95V~3.6V
Core Processor	XCore
Program Memory Type	ROMless
Core Size	32-Bit 8-Core
Core Architecture	XCore
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
168	$8.94202	$1502.25936

XL208-128-FB236-C10 Overview

There is a 236-LFBGA package available. The board has 128 I/Os. Using the Mounting Type Surface Mount, the MCU is mounted on PCB. A 32-Bit 8-Core core is used in order to power the IC chip. The type of memory it uses for its program is ROMless. 0°C~70°C TA is the temperature range at which this Microcontroller operates. XL-series components are electrical components. Powered by a XCore Core processor. On the chip, there are 236 pins that can be accessed. ROMless memory is one of the features of this equipment. The CPU is based on XCore cores.