ROMless XCore 32-Bit 8-Core Microcontroller XL Series 236 Pin 236-LFBGA
SOT-23
XL208-128-FB236-I10 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
236-LFBGA
Number of Pins
236
Supplier Device Package
236-FBGA (10x10)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
XL
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Oscillator Type
External
Number of I/O
128
Speed
1000MIPS
RAM Size
128K x 8
Memory Type
ROMless
Voltage - Supply (Vcc/Vdd)
0.95V~3.6V
Core Processor
XCore
Program Memory Type
ROMless
Core Size
32-Bit 8-Core
Core Architecture
XCore
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
168
$9.92798
$1667.90064
XL208-128-FB236-I10 Product Details
XL208-128-FB236-I10 Overview
The package has a 236-LFBGA shape. With 128 I/Os, it's pretty good. The Microcontroller's mounting type is Surface Mount and this IC chip has the following features. As the name implies, this Microcontroller is based on the 32-Bit 8-Core core. As far as its program memory type is concerned, it is ROMless. Temperatures within -40°C~85°C TA range are measured by this Microcontroller. The XL series is comprised of this electrical component. There's a XCore Core Processor inside. It is possible to access the 236 pins on the chip. The equipment on this page features ROMless memory technology. This device features a XCore core architecture.
XL208-128-FB236-I10 Features
236-LFBGA package Mounting type of Surface Mount Minimum temperature of -40°C
XL208-128-FB236-I10 Applications
There are a lot of XMOS XL208-128-FB236-I10 Microcontroller applications.