ROMless XCore 32-Bit 8-Core Microcontroller XL Series 236 Pin 236-LFBGA
SOT-23
XL208-256-FB236-I10 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
236-LFBGA
Number of Pins
236
Supplier Device Package
236-FBGA (10x10)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
XL
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Oscillator Type
External
Number of I/O
128
Speed
1000MIPS
RAM Size
256K x 8
Memory Type
ROMless
Voltage - Supply (Vcc/Vdd)
0.95V~3.6V
Core Processor
XCore
Program Memory Type
ROMless
Core Size
32-Bit 8-Core
Core Architecture
XCore
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
168
$10.16601
$1707.88968
XL208-256-FB236-I10 Product Details
XL208-256-FB236-I10 Overview
236-LFBGA-packages are available. There are 128 I/O ports on this device. Device mounting type Surface Mount is the type of mounting that the Microcontroller uses. There is a 32-Bit 8-Core core at the core of this MCU. There is a type of program memory called ROMless in the Microcontroller. There is a temperature range of -40°C~85°C TA for this Microcontroller. An electrical component of this type belongs to the XL series. XCore Core processors are used in MCU. In this chip, 236 pins can be accessed. There is ROMless memory in this equipment. As a result of its XCore core architecture, it can be used in many applications.
XL208-256-FB236-I10 Features
236-LFBGA package Mounting type of Surface Mount Minimum temperature of -40°C
XL208-256-FB236-I10 Applications
There are a lot of XMOS XL208-256-FB236-I10 Microcontroller applications.