ROMless XCore 32-Bit 12-Core Microcontroller XL Series 236 Pin 236-LFBGA
SOT-23
XL212-256-FB236-C20 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
236-LFBGA
Number of Pins
236
Supplier Device Package
236-FBGA (10x10)
Operating Temperature
0°C~70°C TA
Packaging
Tray
Series
XL
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Oscillator Type
External
Number of I/O
128
Speed
2000MIPS
RAM Size
256K x 8
Memory Type
ROMless
Voltage - Supply (Vcc/Vdd)
0.95V~3.6V
Core Processor
XCore
Program Memory Type
ROMless
Core Size
32-Bit 12-Core
Core Architecture
XCore
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
168
$10.08101
$1693.60968
XL212-256-FB236-C20 Product Details
XL212-256-FB236-C20 Overview
This Microcontroller comes in a 236-LFBGA package. This Microcontroller has 128 I/Os. The Mounting Type of the Microcontroller is Surface Mount. The MCU is based on the 32-Bit 12-Core core. This Microcontroller's program memory type is ROMless. The Microcontroller runs in 0°C~70°C TA Operating Temperature. Microcontroller runs in XL Series. MCU is powered by XCore Core Processor. The pin number of the component remains 236. This equipment features ROMless memory. It has a XCore core architecture integrated into it.
XL212-256-FB236-C20 Features
236-LFBGA package Mounting type of Surface Mount Minimum temperature of 0°C
XL212-256-FB236-C20 Applications
There are a lot of XMOS XL212-256-FB236-C20 Microcontroller applications.