ROMless XCore 32-Bit 16-Core Microcontroller XL Series 236 Pin 236-LFBGA
SOT-23
XL216-512-FB236-C20 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
236-LFBGA
Number of Pins
236
Supplier Device Package
236-FBGA (10x10)
Operating Temperature
0°C~70°C TA
Packaging
Tray
Series
XL
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Oscillator Type
External
Number of I/O
128
Speed
2000MIPS
RAM Size
512K x 8
Memory Type
ROMless
Voltage - Supply (Vcc/Vdd)
0.95V~3.6V
Core Processor
XCore
Program Memory Type
ROMless
Core Size
32-Bit 16-Core
Core Architecture
XCore
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
168
$10.76101
$1807.84968
XL216-512-FB236-C20 Product Details
XL216-512-FB236-C20 Overview
The package is 236-LFBGA-shaped. There are 128 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 32-Bit 16-Core core architecture. The type of program memory it uses is ROMless. Temperatures in the range of 0°C~70°C TA are operated by this Microcontroller. It is part of the XL series of electrical components. A XCore Core Processor is at the core of this Microcontroller. On the chip, 236 pins are accessible. There is ROMless memory on this piece of equipment. In addition, it comes with a XCore core architecture.
XL216-512-FB236-C20 Features
236-LFBGA package Mounting type of Surface Mount Minimum temperature of 0°C
XL216-512-FB236-C20 Applications
There are a lot of XMOS XL216-512-FB236-C20 Microcontroller applications.