1MB 1M x 8 FLASH XCore 32-Bit 8-Core Microcontroller XLF Series 236 Pin 236-LFBGA
SOT-23
XLF208-256-FB236-I10 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
236-LFBGA
Number of Pins
236
Supplier Device Package
236-FBGA (10x10)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
XLF
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Memory Size
1MB
Oscillator Type
External
Number of I/O
128
Speed
1000MIPS
RAM Size
256K x 8
Memory Type
FLASH
Voltage - Supply (Vcc/Vdd)
0.95V~3.6V
Core Processor
XCore
Program Memory Type
FLASH
Core Size
32-Bit 8-Core
Program Memory Size
1MB 1M x 8
Core Architecture
XCore
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
168
$10.94798
$1839.26064
XLF208-256-FB236-I10 Product Details
XLF208-256-FB236-I10 Overview
The package has a 236-LFBGA shape. With 128 I/Os, it's pretty good. The Microcontroller's mounting type is Surface Mount and this IC chip has the following features. As the name implies, this Microcontroller is based on the 32-Bit 8-Core core. As far as its program memory type is concerned, it is FLASH. Temperatures within -40°C~85°C TA range are measured by this Microcontroller. The XLF series is comprised of this electrical component. The electronic part has a program memory size of 1MB 1M x 8. There's a XCore Core Processor inside. Its memory size is 1MB. It is possible to access the 236 pins on the chip. The equipment on this page features FLASH memory technology. This device features a XCore core architecture.
XLF208-256-FB236-I10 Features
236-LFBGA package Mounting type of Surface Mount Minimum temperature of -40°C
XLF208-256-FB236-I10 Applications
There are a lot of XMOS XLF208-256-FB236-I10 Microcontroller applications.