XLF212-256-FB236-C20

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Manufacturer part number:XLF212-256-FB236-C20

Manufacturer:XMOS

Description:2MB 2M x 8 FLASH XCore 32-Bit 12-Core Microcontroller XLF Series 236 Pin 236-LFBGA

Case Package:SOT-23

Datasheet:XLF212-256-FB236-C20 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	12 Weeks
Mounting Type	Surface Mount
Package / Case	236-LFBGA
Number of Pins	236
Supplier Device Package	236-FBGA (10x10)
Operating Temperature	0°C~70°C TA
Packaging	Tray
Series	XLF
Published	2015
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	70°C
Min Operating Temperature	0°C
Memory Size	2MB
Oscillator Type	External
Number of I/O	128
Speed	2000MIPS
RAM Size	256K x 8
Memory Type	FLASH
Voltage - Supply (Vcc/Vdd)	0.95V~3.6V
Core Processor	XCore
Program Memory Type	FLASH
Core Size	32-Bit 12-Core
Program Memory Size	2MB 2M x 8
Core Architecture	XCore
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
168	$11.47500	$1927.8

XLF212-256-FB236-C20 Overview

Packaged in a 236-LFBGA format. A total of 128 I/Os are on the Microcontroller. Surface Mount is the mounting type of the Microcontroller that is attached to the panel. This Microcontroller is based on a core called 32-Bit 12-Core. The type of its program memory is FLASH. In this Microcontroller, temperature is controlled within the range 0°C~70°C TA. A XLF series electrical component is used in this application. This program has a program memory of 2MB 2M x 8 bytes, which is the size of the program. With a XCore Core Processor, Microcontroller is fast and efficient. There is 2MB memory size assigned to the part. Chips have 236 pins. The equipment has a FLASH memory that is built in. It is equipped with a XCore core architecture which is integrated into it.