XLF216-256-FB236-C20

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Manufacturer part number:XLF216-256-FB236-C20

Manufacturer:XMOS

Description:2MB 2M x 8 FLASH XCore 32-Bit 16-Core Microcontroller XLF Series 236 Pin 236-LFBGA

Case Package:SOT-23

Datasheet:XLF216-256-FB236-C20 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	12 Weeks
Mounting Type	Surface Mount
Package / Case	236-LFBGA
Number of Pins	236
Supplier Device Package	236-FBGA (10x10)
Operating Temperature	0°C~70°C TA
Packaging	Tray
Series	XLF
Published	2015
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	70°C
Min Operating Temperature	0°C
Memory Size	2MB
Oscillator Type	External
Number of I/O	128
Speed	2000MIPS
RAM Size	256K x 8
Memory Type	FLASH
Voltage - Supply (Vcc/Vdd)	0.95V~3.6V
Core Processor	XCore
Program Memory Type	FLASH
Core Size	32-Bit 16-Core
Program Memory Size	2MB 2M x 8
Core Architecture	XCore
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
168	$11.93399	$2004.91032

XLF216-256-FB236-C20 Overview

The package is in 236-LFBGA format. The MCU has 128 I/O ports. There is a mounting type Surface Mount associated with this Microcontroller. This Microcontroller is based on the 32-Bit 16-Core core. There is a memory type of FLASH in its program memory. The temperature range that this Microcontroller operates at is 0°C~70°C TA. The electrical component that you are looking at belongs to the XLF series of components. Microcontroller has abundant program memory size of 2MB 2M x 8. The XCore Core Processor powers the device and is one of its key features. This MCU is implemented with 2MB memory. It is possible to access the 236 pins on the chip through the 236 pins. There's an integrated FLASH memory in the equipment. There is a XCore core architecture integrated into it.