XLF216-512-FB236-C20

join

new-10%

Manufacturer part number:XLF216-512-FB236-C20

Manufacturer:XMOS

Description:2MB 2M x 8 FLASH XCore 32-Bit 16-Core Microcontroller XLF Series 236 Pin 236-LFBGA

Case Package:SOT-23

Datasheet:XLF216-512-FB236-C20 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	12 Weeks
Mounting Type	Surface Mount
Package / Case	236-LFBGA
Number of Pins	236
Supplier Device Package	236-FBGA (10x10)
Operating Temperature	0°C~70°C TA
Packaging	Tray
Series	XLF
Published	2015
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	70°C
Min Operating Temperature	0°C
Memory Size	2MB
Oscillator Type	External
Number of I/O	128
Speed	2000MIPS
RAM Size	512K x 8
Memory Type	FLASH
Voltage - Supply (Vcc/Vdd)	0.95V~3.6V
Core Processor	XCore
Program Memory Type	FLASH
Core Size	32-Bit 16-Core
Program Memory Size	2MB 2M x 8
Core Architecture	XCore
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
168	$12.15500	$2042.04

XLF216-512-FB236-C20 Overview

236-LFBGA-packages are available. There are 128 I/O ports on this device. Device mounting type Surface Mount is the type of mounting that the Microcontroller uses. There is a 32-Bit 16-Core core at the core of this MCU. There is a type of program memory called FLASH in the Microcontroller. There is a temperature range of 0°C~70°C TA for this Microcontroller. An electrical component of this type belongs to the XLF series. This program memory has a size of 2MB 2M x 8, which indicates what the size of the program memory is. XCore Core processors are used in MCU. The part has a memory size of 2MB. In this chip, 236 pins can be accessed. There is FLASH memory in this equipment. As a result of its XCore core architecture, it can be used in many applications.