256KB 64K x 32 SRAM XCore 32-Bit Quad-Core Microcontroller XS1 Series 512 Pin 512-LFBGA
SOT-23
XS1-G04B-FB512-I4 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
512-LFBGA
Number of Pins
512
Supplier Device Package
512-PBGA (20x20)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
XS1
Published
2012
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Interface
USB
Memory Size
256kB
Oscillator Type
External
Number of I/O
256
Speed
400MIPS
RAM Size
64kB
Memory Type
SRAM
Voltage - Supply (Vcc/Vdd)
0.95V~3.6V
Core Processor
XCore
Program Memory Type
SRAM
Core Size
32-Bit Quad-Core
Program Memory Size
256KB 64K x 32
Connectivity
Configurable
Core Architecture
XCore
Speed Grade
400 MIPS
RoHS Status
ROHS3 Compliant
XS1-G04B-FB512-I4 Product Details
XS1-G04B-FB512-I4 Overview
512-LFBGA-packages are available. There are 256 I/O ports on this device. Device mounting type Surface Mount is the type of mounting that the Microcontroller uses. There is a 32-Bit Quad-Core core at the core of this MCU. There is a type of program memory called SRAM in the Microcontroller. There is a temperature range of -40°C~85°C TA for this Microcontroller. An electrical component of this type belongs to the XS1 series. This program memory has a size of 256KB 64K x 32, which indicates what the size of the program memory is. XCore Core processors are used in MCU. The part has a memory size of 256kB. In this chip, 512 pins can be accessed. There is SRAM memory in this equipment. As a result of its XCore core architecture, it can be used in many applications.
XS1-G04B-FB512-I4 Features
512-LFBGA package Mounting type of Surface Mount Minimum temperature of -40°C
XS1-G04B-FB512-I4 Applications
There are a lot of XMOS XS1-G04B-FB512-I4 Microcontroller applications.