128KB 32K x 32 SRAM XCore 32-Bit Dual-Core Microcontroller XS1 Series 124-TFQFN Dual Rows, Exposed Pad
SOT-23
XS1-L02A-QF124-C5-THS Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
124-TFQFN Dual Rows, Exposed Pad
Supplier Device Package
124-QFN DualRow (10x10)
Operating Temperature
0°C~70°C TA
Packaging
Tray
Series
XS1
Published
2010
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Interface
USB
Memory Size
128kB
Oscillator Type
External
Number of I/O
84
Speed
500MIPS
Memory Type
SRAM
Voltage - Supply (Vcc/Vdd)
0.95V~3.6V
Core Processor
XCore
Program Memory Type
SRAM
Core Size
32-Bit Dual-Core
Program Memory Size
128KB 32K x 32
Connectivity
Configurable
Core Architecture
XCore
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
184
$20.44522
$3761.92048
XS1-L02A-QF124-C5-THS Product Details
XS1-L02A-QF124-C5-THS Overview
The package is 124-TFQFN Dual Rows, Exposed Pad-shaped. There are 84 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 32-Bit Dual-Core core architecture. The type of program memory it uses is SRAM. Temperatures in the range of 0°C~70°C TA are operated by this Microcontroller. It is part of the XS1 series of electrical components. Having a size of 128KB 32K x 32, Microcontroller has a program memory of X bytes. A XCore Core Processor is at the core of this Microcontroller. 128kB is the size of the memory in the IC part. There is SRAM memory on this piece of equipment. In addition, it comes with a XCore core architecture.
XS1-L02A-QF124-C5-THS Features
124-TFQFN Dual Rows, Exposed Pad package Mounting type of Surface Mount Minimum temperature of 0°C
XS1-L02A-QF124-C5-THS Applications
There are a lot of XMOS XS1-L02A-QF124-C5-THS Microcontroller applications.