ROMless XCore 32-Bit 12-Core Microcontroller XU Series 236 Pin 236-LFBGA
SOT-23
XU212-256-FB236-I20 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
236-LFBGA
Number of Pins
236
Supplier Device Package
236-FBGA (10x10)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
XU
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Interface
USB
Oscillator Type
External
Number of I/O
104
Speed
2000MIPS
RAM Size
256K x 8
Memory Type
ROMless
Voltage - Supply (Vcc/Vdd)
0.95V~3.6V
Core Processor
XCore
Program Memory Type
ROMless
Core Size
32-Bit 12-Core
Connectivity
USB
Core Architecture
XCore
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
168
$12.54601
$2107.72968
XU212-256-FB236-I20 Product Details
XU212-256-FB236-I20 Overview
Packaged in a 236-LFBGA format. A total of 104 I/Os are on the Microcontroller. Surface Mount is the mounting type of the Microcontroller that is attached to the panel. This Microcontroller is based on a core called 32-Bit 12-Core. The type of its program memory is ROMless. In this Microcontroller, temperature is controlled within the range -40°C~85°C TA. A XU series electrical component is used in this application. With a XCore Core Processor, Microcontroller is fast and efficient. Chips have 236 pins. The equipment has a ROMless memory that is built in. It is equipped with a XCore core architecture which is integrated into it.
XU212-256-FB236-I20 Features
236-LFBGA package Mounting type of Surface Mount Minimum temperature of -40°C
XU212-256-FB236-I20 Applications
There are a lot of XMOS XU212-256-FB236-I20 Microcontroller applications.