ROMless XCore 32-Bit 16-Core Microcontroller XU Series 236 Pin 236-LFBGA
SOT-23
XU216-256-FB236-I20 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
236-LFBGA
Number of Pins
236
Supplier Device Package
236-FBGA (10x10)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
XU
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Interface
USB
Oscillator Type
External
Number of I/O
104
Speed
2000MIPS
RAM Size
256K x 8
Memory Type
ROMless
Voltage - Supply (Vcc/Vdd)
0.95V~3.6V
Core Processor
XCore
Program Memory Type
ROMless
Core Size
32-Bit 16-Core
Connectivity
USB
Core Architecture
XCore
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
168
$13.05601
$2193.40968
XU216-256-FB236-I20 Product Details
XU216-256-FB236-I20 Overview
The package is 236-LFBGA-shaped. There are 104 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 32-Bit 16-Core core architecture. The type of program memory it uses is ROMless. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. It is part of the XU series of electrical components. A XCore Core Processor is at the core of this Microcontroller. On the chip, 236 pins are accessible. There is ROMless memory on this piece of equipment. In addition, it comes with a XCore core architecture.
XU216-256-FB236-I20 Features
236-LFBGA package Mounting type of Surface Mount Minimum temperature of -40°C
XU216-256-FB236-I20 Applications
There are a lot of XMOS XU216-256-FB236-I20 Microcontroller applications.