ROMless XCore 32-Bit 24-Core Microcontroller XU Series 374 Pin 374-LFBGA
SOT-23
XU224-512-FB374-C40 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
374-LFBGA
Number of Pins
374
Supplier Device Package
374-FBGA (18x18)
Operating Temperature
0°C~70°C TA
Packaging
Tray
Series
XU
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Interface
USB
Oscillator Type
External
Number of I/O
176
Speed
4000MIPS
RAM Size
512K x 8
Memory Type
ROMless
Voltage - Supply (Vcc/Vdd)
0.95V~3.6V
Core Processor
XCore
Program Memory Type
ROMless
Core Size
32-Bit 24-Core
Connectivity
USB
Core Architecture
XCore
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
84
$17.70452
$1487.17968
XU224-512-FB374-C40 Product Details
XU224-512-FB374-C40 Overview
The package is 374-LFBGA-shaped. There are 176 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 32-Bit 24-Core core architecture. The type of program memory it uses is ROMless. Temperatures in the range of 0°C~70°C TA are operated by this Microcontroller. It is part of the XU series of electrical components. A XCore Core Processor is at the core of this Microcontroller. On the chip, 374 pins are accessible. There is ROMless memory on this piece of equipment. In addition, it comes with a XCore core architecture.
XU224-512-FB374-C40 Features
374-LFBGA package Mounting type of Surface Mount Minimum temperature of 0°C
XU224-512-FB374-C40 Applications
There are a lot of XMOS XU224-512-FB374-C40 Microcontroller applications.