228-1277-00-0602J

new-10%

Manufacturer part number:228-1277-00-0602J

Manufacturer:3M

Description:228-1277-00-0602J datasheet pdf and Sockets for ICs, Transistors product details from 3M stock available on our website

Case Package:SOT-23

Datasheet:228-1277-00-0602J Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	8 Weeks
Contact Material	Copper
Contact Plating	Gold
Mount	Through Hole
Mounting Type	Connector
Package / Case	DIP
Number of Pins	28
Insulation Material	Polysulfone
Housing Material	Polysulfone (PSU), Glass Filled
Weight	453.59237g
Body Material	Glass, Polysulfone
Number of Positions or Pins (Grid)	28 (2 x 14)
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Operating Temperature	-55°C~125°C
Packaging	Tray
Series	Textool™
Published	2000
Feature	Closed Frame
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Press-Fit
Connector Type	DIP, Socket
Type	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing
Number of Positions	28
Max Operating Temperature	150°C
Min Operating Temperature	-55°C
Number of Rows	2
Gender	Female
Contact Finish - Mating	Gold
Current Rating (Amps)	1A
Pitch	2.54mm
Orientation	Straight
Depth	17.8mm
Current Rating	1A
Pitch - Mating	0.100 2.54mm
Lead Pitch	2.54mm
Number of Contacts	28
Contact Finish - Post	Gold
Insulation Resistance	1GOhm
Row Spacing	15.24 mm
Number of Poles	28
Termination Post Length	0.110 2.78mm
Pitch - Post	0.100 2.54mm
Length	62.8mm
Width	11.9mm
Contact Finish Thickness - Mating	30.0μin 0.76μm
Contact Finish Thickness - Post	30.0μin 0.76μm
Material Flammability Rating	UL94 V-0
REACH SVHC	No SVHC
RoHS Status	RoHS Compliant
Flammability Rating	UL94 V-0
Lead Free	Lead Free