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54122-111342100LF

54122-111342100LF

54122-111342100LF

Amphenol ICC (FCI)

54122-111342100LF datasheet pdf and Rectangular Connectors - Board Spacers, Stackers (Board to Board) product details from Amphenol ICC (FCI) stock available on our website

SOT-23

54122-111342100LF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 9 Weeks
Contact Material Bronze
Contact Plating GXT, Gold
Mount Through Hole
Mounting Type Through Hole
Housing Material Thermoplastic
Packaging Bulk
Published 2017
Series BERGSTIK®, MezzSelect™, Basics+
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 34
Max Operating Temperature 125°C
Min Operating Temperature -65°C
Color Black
Number of Rows 2
Gender Male
Voltage - Rated 1.5kV
Pitch 0.100 2.54mm
Orientation Straight
Depth 4.83mm
Current Rating 3A
Number of Contacts 34
Contact Gender Male
Housing Color Black
Lead Length 3.05mm
Contact Finish - Post (Mating) Gold, GXT™
Insulation Resistance 5GOhm
Row Spacing 0.100 (2.54mm)
Max Voltage Rating (AC) 1.5kV
Length 31.115mm
Length - Stack Height 0.827 21.000mm
Length - Overall Pin 1.225 31.115mm
Length - Post (Mating) 0.279 7.087mm
Contact Finish Thickness - Post (Mating) 30.0μin 0.76μm
Length - Tail 0.120 3.050mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
200 $2.42640 $485.28
54122-111342100LF Product Details

54122-111342100LF Overview


There is a mounting type of Through Hole for this device.To package the product, a Bulk case is used.This product is part of the BERGSTIK?, MezzSelect?, Basics+ Series.The ideal temperature for using it is below 125°C.There is a minimum temperature requirement of [0°C] for this device.

54122-111342100LF Features


BERGSTIK?, MezzSelect?, Basics+ series

54122-111342100LF Applications


There are a lot of Amphenol ICC (FCI) 54122-111342100LF Rectangular Connectors applications.

  • Communication
  • Data Technology
  • Measuring & Control Technology
  • Datacom
  • Instrumentation
  • Industrial Automation
  • Embedded systems
  • Telecommunications
  • Medical technology
  • Transportation

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