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67997-804HLF

67997-804HLF

67997-804HLF

Amphenol ICC (FCI)

BERGSTIK® II Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole Gold or Gold, GXT™ 4-Position Board to Board 0.100 2.54mm Height

SOT-23

67997-804HLF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Contact Material Phosphor Bronze
Contact Plating GXT, Gold
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Housing Material Thermoplastic
Packaging Bulk
Series BERGSTIK® II
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 4
Color Black
Number of Rows 2
Gender Male
Voltage - Rated 1.5kV
Fastening Type Push-Pull
Contact Finish - Mating Gold or Gold, GXT™
Contact Type Male Pin
Pitch 2.54mm
Insulation Height 0.100 2.54mm
Style Board to Board
Number of Positions Loaded All
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.120 3.05mm
Shrouding Unshrouded
Number of Contacts 4
Contact Length - Mating 0.230 5.84mm
Contact Gender Male
Lead Length 3.05mm
Overall Contact Length 0.450 11.43mm
Insulation Resistance 5GOhm
Mating Post Length 5.84mm
Contact Finish Thickness - Mating 15.0μin 0.38μm
Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
67997-804HLF Product Details

67997-804HLF Overview


Packaging is in the form of Header.This device has a Through Hole mounting type.An orange Bulk case is used to package the product.Specifically, it is one of the products in the BERGSTIK® II Series.There is a mounting hole at Through Hole.

67997-804HLF Features


BERGSTIK® II series


67997-804HLF Applications


There are a lot of Amphenol ICC (FCI)
67997-804HLF Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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