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68001-404H

68001-404H

68001-404H

Amphenol ICC (FCI)

BERGSTIK® II Series 1-Row Header Solder Phosphor Bronze Bulk Through Hole Tin 4-Position Board to Board 0.100 2.54mm Height

SOT-23

68001-404H Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Contact Material Phosphor Bronze
Contact Plating Tin
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Housing Material Thermoplastic
Packaging Bulk
Series BERGSTIK® II
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 4
Max Operating Temperature 125°C
Min Operating Temperature -65°C
Color Black
Number of Rows 1
Gender Male
Voltage - Rated 1.5kV
Fastening Type Push-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Pitch 2.54mm
Orientation Straight
Depth 2.41mm
Insulation Height 0.100 2.54mm
Style Board to Board
Number of Positions Loaded All
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Length - Post 0.120 3.05mm
Shrouding Unshrouded
Contact Length - Mating 0.230 5.84mm
Contact Gender Male
Housing Color Black
Lead Length 3.05mm
Overall Contact Length 0.450 11.43mm
Insulation Resistance 5GOhm
Max Voltage Rating (AC) 1.5kV
Mating Post Length 5.84mm
Length 10.16mm
Contact Finish Thickness - Mating 100.0μin 2.54μm
Material Flammability Rating UL94 V-0
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
8,000 $0.17616 $1.40928
68001-404H Product Details

68001-404H Overview


This product is packaged in a Header box.Through Hole indicates that the device is mounted.An Bulk case is utilized for packaging the product.The product is a part of the BERGSTIK® II Series.Use it below 125°C.A minimum temperature of -65°C must be maintained for the operation of this device.By Through Hole, the part is mounted.

68001-404H Features


BERGSTIK® II series


68001-404H Applications


There are a lot of Amphenol ICC (FCI)
68001-404H Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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