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68022-406

68022-406

68022-406

Amphenol ICC (FCI)

BERGSTIK® II Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole, Right Angle Tin 6-Position Board to Board 0.240 6.10mm Height

SOT-23

68022-406 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Contact Material Phosphor Bronze
Mount Through Hole
Mounting Type Through Hole, Right Angle
Contact Shape Square
Housing Material Thermoplastic
Packaging Bulk
Series BERGSTIK® II
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 6
Max Operating Temperature 125°C
Min Operating Temperature -65°C
Number of Rows 2
Voltage - Rated 1.5kV
Fastening Type Push-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Orientation Right Angle
Depth 14.68mm
Insulation Height 0.240 6.10mm
Style Board to Board
Number of Positions Loaded All
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.110 2.79mm
Shrouding Unshrouded
Contact Length - Mating 0.318 8.08mm
Contact Gender Male
Housing Color Black
Lead Length 2.79mm
Insulation Resistance 5GOhm
Max Voltage Rating (AC) 1.5kV
Mating Post Length 8.08mm
Length 7.62mm
Contact Finish Thickness - Mating 100.0μin 2.54μm
Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
4,000 $0.22410 $0.8964
68022-406 Product Details

68022-406 Overview


The packaging contains Header.There is a Through Hole, Right Angle mounting type for the device.This product is packaged in a case marked Bulk.Product number BERGSTIK® II belongs to the BERGSTIK® II Series.Whenever the temperature is below 125°C, it's best.There is a minimum temperature requirement of [0°C] for this device.There is a Through Hole mount on the part.

68022-406 Features


BERGSTIK® II series


68022-406 Applications


There are a lot of Amphenol ICC (FCI)
68022-406 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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