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77311-402-32LF

77311-402-32LF

77311-402-32LF

Amphenol ICC (FCI)

BERGSTIK® Series 1-Row Header Solder Phosphor Bronze Bulk Through Hole Tin Thermoplastic 32-Position Board to Board 0.100 2.54mm Height

SOT-23

77311-402-32LF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 7 Weeks
Contact Material Phosphor Bronze
Contact Plating Tin
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Insulation Material Thermoplastic
Housing Material Thermoplastic
Packaging Bulk
Series BERGSTIK®
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 32
Max Operating Temperature 125°C
Min Operating Temperature -65°C
Color Black
Number of Rows 1
Fastening Type Push-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Pitch 2.54mm
Orientation Straight
Depth 2.4mm
Insulation Height 0.100 2.54mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Length - Post 0.135 3.43mm
Shrouding Unshrouded
Number of Contacts 32
Contact Finish - Post Tin
Contact Length - Mating 0.230 5.84mm
Housing Color Black
Overall Contact Length 0.465 11.81mm
Max Voltage Rating (AC) 1.5kV
Length 81.28mm
Contact Finish Thickness - Mating 78.7μin 2.00μm
Contact Finish Thickness - Post 78.7μin 2.00μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
400 $1.21105 $484.42
77311-402-32LF Product Details

77311-402-32LF Overview


A Header package is included with it.Its mounting type is Through Hole.Packaging is performed using a Bulk case.It is part of the BERGSTIK® Series of products.Whenever it's below 125°C, it's best to use it.The device must operate at a temperature of -65°C at all times.Through Hole mounts the part.

77311-402-32LF Features


BERGSTIK® series


77311-402-32LF Applications


There are a lot of Amphenol ICC (FCI)
77311-402-32LF Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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