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78548-114HLF

78548-114HLF

78548-114HLF

Amphenol ICC (FCI)

BERGSTIK® II Series 2-Row Header Kinked Pin, Solder Phosphor Bronze Bulk Through Hole Gold or Gold, GXT™ Polycyclohexylenedimethylene Terephthalate (PCT) 14-Position Board to Board 0.100 2.

SOT-23

78548-114HLF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Contact Material Phosphor Bronze
Contact Plating GXT, Gold
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT)
Packaging Bulk
Series BERGSTIK® II
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Kinked Pin, Solder
Connector Type Header
Number of Positions 14
Color Black
Number of Rows 2
Gender Male
Fastening Type Push-Pull
Contact Finish - Mating Gold or Gold, GXT™
Contact Type Male Pin
Pitch 2.54mm
Insulation Height 0.100 2.54mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.120 3.05mm
Shrouding Unshrouded
Number of Contacts 14
Contact Length - Mating 0.318 8.08mm
Overall Contact Length 0.538 13.67mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
2,000 $0.59143 $1.18286
78548-114HLF Product Details

78548-114HLF Overview


This product is packaged in a Header box.Through Hole indicates that the device is mounted.An Bulk case is utilized for packaging the product.The product is a part of the BERGSTIK® II Series.By Through Hole, the part is mounted.

78548-114HLF Features


BERGSTIK® II series


78548-114HLF Applications


There are a lot of Amphenol ICC (FCI)
78548-114HLF Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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