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91276-236HLF

91276-236HLF

91276-236HLF

Amphenol ICC (FCI)

BERGSTIK® II Series 1-Row Header Solder Phosphor Bronze Bulk Through Hole Gold or Gold, GXT™ 36-Position Board to Board 0.100 2.54mm Height

SOT-23

91276-236HLF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Contact Material Phosphor Bronze
Contact Plating GXT, Gold
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Packaging Bulk
Series BERGSTIK® II
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 36
Max Operating Temperature 125°C
Min Operating Temperature -65°C
Color Black
Number of Rows 1
Fastening Type Push-Pull
Contact Finish - Mating Gold or Gold, GXT™
Contact Type Male Pin
Pitch 2.54mm
Orientation Straight
Depth 2.41mm
Insulation Height 0.100 2.54mm
Style Board to Board
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Length - Post 0.225 5.72mm
Shrouding Unshrouded
Number of Contacts 36
Contact Length - Mating 0.900 22.86mm
Housing Color Black
Overall Contact Length 1.225 31.12mm
Max Voltage Rating (AC) 1.5kV
Length 91.44mm
Contact Finish Thickness - Mating 15.0μin 0.38μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $0.894200 $0.8942
10 $0.843585 $8.43585
100 $0.795835 $79.5835
500 $0.750788 $375.394
1000 $0.708290 $708.29
91276-236HLF Product Details

91276-236HLF Overview


It comes in Header packaging.The device's mounting type is Through Hole.In order to package the product, a Bulk case is used.It belongs to the BERGSTIK® II Series of products.It's best to use it when the temperature is below 125°C.This device must operate at a minimum temperature of -65°C.The part is mounted by Through Hole.

91276-236HLF Features


BERGSTIK® II series


91276-236HLF Applications


There are a lot of Amphenol ICC (FCI)
91276-236HLF Rectangular Connectors applications.


  • Industrial Automation
  • Transportation
  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics

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