DILB18P-223TLF

new-10%

Manufacturer part number:DILB18P-223TLF

Manufacturer:Amphenol ICC (FCI)

Description:DILB18P-223TLF datasheet pdf and Sockets for ICs, Transistors product details from Amphenol ICC (FCI) stock available on our website

Case Package:SOT-23

Datasheet:DILB18P-223TLF Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	11 Weeks
Contact Material	Bronze
Contact Plating	Tin
Mount	Through Hole
Mounting Type	Through Hole
Package / Case	DIP
Insulation Material	Polyester
Housing Material	Polyamide (PA), Nylon
Number of Positions or Pins (Grid)	18 (2 x 9)
Contact Material - Mating	Copper Alloy
Contact Material - Post	Copper Alloy
Operating Temperature	-55°C~125°C
Packaging	Tube
Series	DILB
Feature	Open Frame
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
Connector Type	DIP, Socket
Type	DIP, 0.3 (7.62mm) Row Spacing
Number of Positions	18
Max Operating Temperature	105°C
Min Operating Temperature	-55°C
Number of Rows	2
Voltage - Rated	200V
Contact Finish - Mating	Tin-Lead
Current Rating (Amps)	1A
Pitch	2.54mm
Orientation	Straight
Depth	10.16mm
Current Rating	1A
Pitch - Mating	0.100 2.54mm
Voltage - Rated AC	200V
Number of Contacts	18
Contact Finish - Post	Tin-Lead
Contact Resistance	30mOhm
Insulation Resistance	500MOhm
Row Spacing	7.62 mm
Termination Post Length	0.124 3.15mm
Pitch - Post	0.100 2.54mm
Length	22.86mm
Width	10.16mm
Contact Finish Thickness - Mating	100.0μin 2.54μm
Contact Finish Thickness - Post	100.0μin 2.54μm
Material Flammability Rating	UL94 V-0
REACH SVHC	No SVHC
Radiation Hardening	No
RoHS Status	RoHS Compliant
Flammability Rating	UL94 V-0