DIP316-001BLF

new-10%

Manufacturer part number:DIP316-001BLF

Manufacturer:Amphenol ICC (FCI)

Description:DIP316-001BLF datasheet pdf and Sockets for ICs, Transistors product details from Amphenol ICC (FCI) stock available on our website

Case Package:SOT-23

Datasheet:DIP316-001BLF Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Contact Material	Copper
Mount	Through Hole
Mounting Type	Through Hole
Insulation Material	Polychlorinated
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins (Grid)	16 (2 x 8)
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Packaging	Tube
Published	2007
JESD-609 Code	e4
Feature	Open Frame
Pbfree Code	yes
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
ECCN Code	EAR99
Connector Type	DIP, Socket
Type	DIP, 0.3 (7.62mm) Row Spacing
Number of Rows	2
HTS Code	8536.69.40.40
Contact Finish - Mating	Gold
Orientation	Straight
Depth	10.16mm
Pitch - Mating	0.100 2.54mm
Number of Contacts	16
Contact Finish - Post	Tin
PCB Contact Pattern	RECTANGULAR
Body Breadth	0.4 inch
Lead Length	3.175mm
Contact Style	RND PIN-SKT
Row Spacing	7.62 mm
Mating Contact Pitch	0.1 inch
Termination Post Length	0.125 3.18mm
Pitch - Post	0.100 2.54mm
Length	20.32mm
Width	10.2mm
Contact Finish Thickness - Mating	30.0μin 0.76μm
Contact Finish Thickness - Post	200.0μin 5.08μm
Material Flammability Rating	UL94 V-0
RoHS Status	RoHS Compliant
Flammability Rating	UL94 V-0