HMC588LC4B datasheet pdf and RF Misc ICs and Modules product details from Analog Devices Inc. stock available on our website
SOT-23
HMC588LC4B Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Lifecycle Status
LAST TIME BUY (Last Updated: 2 weeks ago)
Contact Plating
Gold
Mounting Type
Surface Mount
Package / Case
24-TFQFN Exposed Pad
Surface Mount
YES
Number of Pins
24
Packaging
Strip
Pbfree Code
no
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
24
Termination
SMD/SMT
ECCN Code
EAR99
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
HTS Code
8542.39.00.01
Subcategory
Other Oscillators
Technology
BIPOLAR
Supply Voltage
5V
Frequency
8GHz~12.5GHz
Base Part Number
HMC588
Function
VCO, Buffer Amp
Qualification Status
Not Qualified
Physical Dimension
4.0mm x 4.0mm x 1.2mm
Operating Frequency
12500MHz
Operating Supply Voltage
5V
Power Supplies
5V
Max Supply Voltage
5.25V
Min Supply Voltage
4.75V
Oscillator Type
VOLTAGE CONTROLLED OSCILLATOR
Supply Current-Max
75mA
Output Power
2dBm
Logic Function
Buffer
Control Voltage-Max
13V
RF Type
Radar
Phase Noise
-65 dBc/Hz
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead
HMC588LC4B Product Details
HMC588LC4B Overview
In this RF modulator, the frequency is 8GHz~12.5GHz.RF IC with the enhanced 24-TFQFN Exposed Pad package.This RF modulator is mounted in the Strip package.Any Surface Mount-type PCB or development board can be used with this RF modulator.24 terminations are integrated into this RF module for driving and receiving signals from data.24-pin RF module with improved power dissipation control.Below 85°C is the required RF switch IC's operating temperature.This RF switch IC must not be operated at a temperature below -40°C when it is at its minimum operating temperature.
HMC588LC4B Features
Frequency of 8GHz~12.5GHz 24-TFQFN Exposed Pad package Strip 24 terminations 24 pins
HMC588LC4B Applications
There are a lot of Analog Devices Inc. HMC588LC4B RF Misc ICs and Modules applications.