HMC709LC5 datasheet pdf and RF Misc ICs and Modules product details from Analog Devices Inc. stock available on our website
SOT-23
HMC709LC5 Datasheet
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Specifications
Name
Value
Type
Parameter
Lifecycle Status
OBSOLETE (Last Updated: 3 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
32-TFQFN Exposed Pad
Number of Pins
32
Packaging
Strip
JESD-609 Code
e4
Pbfree Code
no
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
32
ECCN Code
EAR99
Max Operating Temperature
85°C
Min Operating Temperature
-55°C
HTS Code
8542.39.00.01
Subcategory
RF/Microwave Up/Down Converters
Max Power Dissipation
1.65mW
Technology
GAAS
Construction
COMPONENT
Frequency
11GHz~17GHZ
Base Part Number
HMC709
Function
Upconverter
Operating Supply Voltage
5V
Power Supplies
5V
Operating Supply Current
127mA
Supply Current-Max
150mA
Gain
13 dB
RF/Microwave Device Type
UP CONVERTER
RF Type
Radar
Characteristic Impedance
50Ohm
LO Tunable
YES
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead
HMC709LC5 Product Details
HMC709LC5 Overview
RF modulator operates based on the frequency of 11GHz~17GHZ.This RF IC is excellent due to its enhanced 32-TFQFN Exposed Pad package.Strip package is used to mount this RF modulator.On any Surface Mount-type PCB or development board, you can install this RF modulator.In order to drive and receive signals from data, this RF module has 32 terminations integrated.The RF module has improved power dissipation control.There must be a RF switch IC's temperature below 85°C during operation.It must not be less than -55°C degrees Celsius for this RF switch IC to operate properly.To deliver its performance, the RF modulator's supply current need to be operated at the range of 127mA.
HMC709LC5 Features
Frequency of 11GHz~17GHZ 32-TFQFN Exposed Pad package Strip 32 terminations 32 pins
HMC709LC5 Applications
There are a lot of Analog Devices Inc. HMC709LC5 RF Misc ICs and Modules applications.