HMC842LC4B datasheet pdf and RF Misc ICs and Modules product details from Analog Devices Inc. stock available on our website
SOT-23
HMC842LC4B Datasheet
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Specifications
Name
Value
Type
Parameter
Lifecycle Status
LAST TIME BUY (Last Updated: 4 days ago)
Mounting Type
Surface Mount
Package / Case
24-TFQFN Exposed Pad
Surface Mount
YES
Number of Pins
24
Weight
928.191737mg
Packaging
Bulk
JESD-609 Code
e4
Pbfree Code
no
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
24
ECCN Code
EAR99
Terminal Finish
Gold (Au) - with Nickel (Ni) barrier
Max Operating Temperature
70°C
Min Operating Temperature
-40°C
HTS Code
8542.39.00.01
Max Power Dissipation
740mW
Terminal Position
QUAD
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Number of Functions
1
Terminal Pitch
0.5mm
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
HMC842
Pin Count
24
Qualification Status
Not Qualified
Temperature Grade
OTHER
Max Supply Voltage
-3.13V
Min Supply Voltage
-3.47V
Operating Supply Current
140mA
Family
842
Data Rate
45 Gbps
Logic IC Type
LOW SKEW CLOCK DRIVER
Number of True Outputs
2
Input Conditioning
DIFFERENTIAL
Height Seated (Max)
1.2mm
Length
4mm
Width
4mm
RoHS Status
ROHS3 Compliant
HMC842LC4B Product Details
HMC842LC4B Overview
Due to the enhanced 24-TFQFN Exposed Pad package, this RF IC is excellent .The package of this RF modulator is Bulk.The RF modulator can be mounted on any Surface Mount-type PCB or development board.For driving and receiving signals from data, this RF module has 24 terminations integrated.RF module with enhanced power dissipation control, 24-pin.During operation, the RF switch IC's temperature must be below 70°C.A minimum operating temperature of -40°C should not be reached by this RF switch IC.The RF modulator's supply current needs to be operated in the range of 140mA.
HMC842LC4B Features
24-TFQFN Exposed Pad package Bulk 24 terminations 24 pins
HMC842LC4B Applications
There are a lot of Analog Devices Inc. HMC842LC4B RF Misc ICs and Modules applications.