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0533751110

0533751110

0533751110

Molex

Mini-Lock 53375 Series 1-Row Header Kinked Pin, Solder Phosphor Bronze Bulk Through Hole Tin Polybutylene Terephthalate (PBTP), Glass Filled 11-Position Board to Cable/Wire 0.453 11.50mm He

SOT-23

0533751110 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact MaterialPhosphor Bronze
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Polybutylene Terephthalate (PBTP), Glass Filled
Operating Temperature-40°C~105°C
PackagingBulk
Series Mini-Lock 53375
Feature Board Guide
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Kinked Pin, Solder
Connector Type Header
Number of Positions 11
Applications General Purpose, Industrial
Number of Rows 1
Voltage - Rated 250V
Fastening TypeLocking Ramp
Contact Finish - Mating Tin
Contact Type Male Pin
Current Rating (Amps) Varies by WireGAuge
Insulation Height 0.453 11.50mm
Style Board to Cable/Wire
Number of Positions Loaded All
Pitch - Mating 0.098 2.50mm
Insulation Color White
Contact Length - Post 0.134 3.40mm
Shrouding Shrouded - 4 Wall
Contact Length - Mating 0.157 4.00mm
Contact Finish Thickness - Mating 39.4μin 1.00μm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:6961 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.75000$0.75
10$0.66100$6.61
100$0.57050$57.05
500$0.46674$233.37

0533751110 Product Details

0533751110 Overview


The product is packaged in Header.This device is mounted in the Through Hole position.It has been determined that a Bulk case is necessary to package the product.There is a product in the Mini-Lock 53375 Series.The device could be used for the following application: General Purpose, Industrial.There are a number of advantages to its Board Guide feature.As a result, the device runs at -40°C~105°C Operating Temperature.

0533751110 Features


Mini-Lock 53375 series


0533751110 Applications


There are a lot of Molex
0533751110 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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