Mini-Lock 53375 Series 1-Row Header Kinked Pin, Solder Phosphor Bronze Bulk Through Hole Tin Polybutylene Terephthalate (PBTP), Glass Filled 11-Position Board to Cable/Wire 0.453 11.50mm He
SOT-23
0533751110 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Contact Material
Phosphor Bronze
Mounting Type
Through Hole
Contact Shape
Circular
Insulation Material
Polybutylene Terephthalate (PBTP), Glass Filled
Operating Temperature
-40°C~105°C
Packaging
Bulk
Series
Mini-Lock 53375
Feature
Board Guide
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
Kinked Pin, Solder
Connector Type
Header
Number of Positions
11
Applications
General Purpose, Industrial
Number of Rows
1
Voltage - Rated
250V
Fastening Type
Locking Ramp
Contact Finish - Mating
Tin
Contact Type
Male Pin
Current Rating (Amps)
Varies by WireGAuge
Insulation Height
0.453 11.50mm
Style
Board to Cable/Wire
Number of Positions Loaded
All
Pitch - Mating
0.098 2.50mm
Insulation Color
White
Contact Length - Post
0.134 3.40mm
Shrouding
Shrouded - 4 Wall
Contact Length - Mating
0.157 4.00mm
Contact Finish Thickness - Mating
39.4μin 1.00μm
Material Flammability Rating
UL94 V-0
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.75000
$0.75
10
$0.66100
$6.61
100
$0.57050
$57.05
500
$0.46674
$233.37
1,000
$0.41488
$0.41488
5,000
$0.36302
$1.8151
10,000
$0.34487
$3.4487
0533751110 Product Details
0533751110 Overview
The product is packaged in Header.This device is mounted in the Through Hole position.It has been determined that a Bulk case is necessary to package the product.There is a product in the Mini-Lock 53375 Series.The device could be used for the following application: General Purpose, Industrial.There are a number of advantages to its Board Guide feature.As a result, the device runs at -40°C~105°C Operating Temperature.
0533751110 Features
Mini-Lock 53375 series
0533751110 Applications
There are a lot of Molex 0533751110 Rectangular Connectors applications.