-40°C~100°C TJ System On Chip Arria 10 SX Series 396 I/O
SOT-23
10AS066K3F35I3SGES Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Package / Case
1152-BBGA, FCBGA
Supplier Device Package
1152-FBGA, FC (35x35)
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Arria 10 SX
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of I/O
396
Speed
1.5GHz
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
FPGA - 660K Logic Elements
10AS066K3F35I3SGES Product Details
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is used to build this SoC.Its package is 1152-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Arria 10 SX series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines FPGA - 660K Logic Elements.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 396.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM. Built on MCU, FPGA.
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10AS066K3F35I3SGES System On Chip (SoC) applications.