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10AX115S3F45I2SGES

10AX115S3F45I2SGES

10AX115S3F45I2SGES

Intel

3.65mm mm FPGAs Arria 10 GX Series 1932-BBGA, FCBGA 1mm mm

SOT-23

10AX115S3F45I2SGES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 1932-BBGA, FCBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria 10 GX
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code8542.39.00.01
Voltage - Supply 0.87V~0.93V
Terminal Position BOTTOM
Terminal FormBALL
Supply Voltage 0.9V
Terminal Pitch1mm
JESD-30 Code S-PBGA-B1932
Number of I/O 624
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of LABs/CLBs 427200
Height Seated (Max) 3.65mm
Length 45mm
Width 45mm
RoHS StatusRoHS Compliant
In-Stock:1703 items

Pricing & Ordering

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10AX115S3F45I2SGES Product Details

10AX115S3F45I2SGES Overview


Fpga chips is supplied in the 1932-BBGA, FCBGA package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 624 I/Os allow data to be transferred in a more coherent manner. Logic blocks consist of 1150000 logic elements/cells. In order for the device to operate, a supply voltage of 0.9V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. With a supply voltage of 0.87V~0.93V, this device operates with ease. The Arria 10 GX Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. It is for space saving reasons that this FPGA model is contained in Tray. This device is equipped with 68857856 RAM bits in terms of its RAM si68857856e. Fpga electronics contains 427200 LABs/CLBs in an array.

10AX115S3F45I2SGES Features


624 I/Os
Up to 68857856 RAM bits

10AX115S3F45I2SGES Applications


There are a lot of Intel 10AX115S3F45I2SGES FPGAs applications.

  • Radar and Sensors
  • Wired Communications
  • Automotive Applications
  • Scientific Instruments
  • Bioinformatics
  • Consumer Electronics
  • Telecommunication
  • High Performance Computing
  • Video & Image Processing
  • Embedded Vision

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