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10M25DAF256A7G

10M25DAF256A7G

10M25DAF256A7G

Intel

FPGAs MAX? 10 Series 256-LBGA 256

SOT-23

10M25DAF256A7G Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series MAX® 10
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish TIN SILVER COPPER
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of I/O 178
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 25000
Total RAM Bits 691200
Number of LABs/CLBs 1563
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
90 $78.62011 $7075.8099
10M25DAF256A7G Product Details

10M25DAF256A7G Overview


Fpga chips is supplied in the 256-LBGA package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. A total of 178 I/Os allow data to be transferred in a more coherent manner. There are 25000 logic elements/cells to form a fundamental building block. With a Surface Mount connector, this FPGA module can be attached to the development board. Powered by a 1.15V~1.25V supply voltage, fpga chips is able to operate at high speeds. As part of the MAX? 10 series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of -40°C~125°C TJ. As a space-saving measure, this FPGA model is contained within Tray. In total, it has a total of 256 terminations. As far as the RAM bits are concerned, this device offers you a total of 691200. A total of 1563 LABs/CLBs make up this FPGA array.

10M25DAF256A7G Features


178 I/Os
Up to 691200 RAM bits

10M25DAF256A7G Applications


There are a lot of Intel 10M25DAF256A7G FPGAs applications.

  • Camera time adjustments
  • Embedded Vision
  • Ecosystem
  • Artificial intelligence (AI)
  • Wired Communications
  • Electronic Warfare
  • Integrating multiple SPLDs
  • Cryptography
  • High Performance Computing
  • Automotive advanced driver assistance systems (ADAS)

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