10M25DAF484I7G Overview

There are two packages that contain fpga chips: 484-BGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 360 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 25000 logic elements/cells. Power is provided by a 1.2V-volt supply. The Field Programmable Gate Arrays family of FPGAs includes this part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. A supply voltage of 1.15V~1.25V is needed in order for fpga chips to operate. An FPGA belonging to the MAX? 10 series is referred to as an FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. During the installation of this device, 360 outputs were incorporated. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 484 terminations. There are 691200 RAM bits that are available with this device. A total of 1563 LABs/CLBs make up this FPGA array. Power is supplied to the device by a 1.2V battery.

10M25DAF484I7G Features

360 I/Os
Up to 691200 RAM bits

10M25DAF484I7G Applications

There are a lot of Intel 10M25DAF484I7G FPGAs applications.

• Military DSP
• Aerospace and Defense
• Random logic
• Cryptography
• Camera time adjustments
• ASIC prototyping
• Radar and Sensors
• Automotive advanced driver assistance systems (ADAS)
• Consumer Electronics
• Electronic Warfare