1SG280HH3F55E3XG Overview

A 2912-BBGA, FCBGA package is provided with this component. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Fpga chips is programmed wFpga chipsh 1160 I/Os for transferring data in a more coherent manner. To form a fundamental building block, there are 2800000 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. There is a 0.82V~0.88V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the Stratix? 10 GX seies. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. This FPGA is built as an array of 350000 LABs/CLBs.

1SG280HH3F55E3XG Features

1160 I/Os

1SG280HH3F55E3XG Applications

There are a lot of Intel 1SG280HH3F55E3XG FPGAs applications.

• Aircraft navigation
• Data Center
• Development Boards and Shields for Microcontrollers
• Security systems
• Space Applications
• Automotive
• Voice recognition
• Industrial IoT
• Video & Image Processing
• High Performance Computing