5AGXFA7H4F35I3G Overview
There are two packages that contain fpga chips: 1152-BBGA, FCBGA Exposed Pad package and X package. 544 I/Os are available for transferring data more efficiently. A fundamental building block consists of 242000 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. The supply voltage of the device is 1.12V~1.18V , at which it runs. This is a type of FPGA that is part of the Arria V GX series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. As a space-saving measure, this FPGA model is contained within Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 15470592 bFpga chipss. 11460 LABs and CLBs are built into this FPGA. The supplier of the device package is 1152-FBGA (35x35).
5AGXFA7H4F35I3G Features
544 I/Os
Up to 15470592 RAM bits
5AGXFA7H4F35I3G Applications
There are a lot of Intel 5AGXFA7H4F35I3G FPGAs applications.
- Wired Communications
- Aerospace and Defense
- Consumer Electronics
- Industrial IoT
- Automotive
- Medical imaging
- Enterprise networking
- Medical Electronics
- Data center hardware accelerators
- OpenCL
