5AGXFA7H4F35I3G Overview

There are two packages that contain fpga chips: 1152-BBGA, FCBGA Exposed Pad package and X package. 544 I/Os are available for transferring data more efficiently. A fundamental building block consists of 242000 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. The supply voltage of the device is 1.12V~1.18V , at which it runs. This is a type of FPGA that is part of the Arria V GX series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. As a space-saving measure, this FPGA model is contained within Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 15470592 bFpga chipss. 11460 LABs and CLBs are built into this FPGA. The supplier of the device package is 1152-FBGA (35x35).

5AGXFA7H4F35I3G Features

544 I/Os
Up to 15470592 RAM bits

5AGXFA7H4F35I3G Applications

There are a lot of Intel 5AGXFA7H4F35I3G FPGAs applications.

• Wired Communications
• Aerospace and Defense
• Consumer Electronics
• Industrial IoT
• Automotive
• Medical imaging
• Enterprise networking
• Medical Electronics
• Data center hardware accelerators
• OpenCL