CENGPXA270-416-10-550EIR datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Logic stock available on our website
SOT-23
CENGPXA270-416-10-550EIR Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Operating Temperature
-40°C~85°C
Published
2007
Size / Dimension
2.37 x 2.67 60.2mmx67.8mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Connector Type
SO-DIMM-144
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Frequency
416MHz
Speed
416MHz
RAM Size
64MB
Core Processor
PXA270
Module/Board Type
MCU Core
Flash Size
64MB
RoHS Status
RoHS Compliant
Lead Free
Lead Free
CENGPXA270-416-10-550EIR Product Details
CENGPXA270-416-10-550EIR Overview
A MCU Core module or board is used in the microcontroller.There are PXA270 cores in the processor.-40°C~85°C is the default setting for the microcontroller.The size of the flash on the MCU electronics is 64MB.The connector type SO-DIMM-144 refers to the connector type.The RAM is reduced to 64MB in order to ensure that the software is able to run normally.During operation, the MCU chip moves at 416MHz speed.At a frequency of 416MHz, MCU chip can continue to function accurately.At this time, 85°C is the maximum temperature that can be operated at.When operating, microprocessor should be warmer than -40°C.
CENGPXA270-416-10-550EIR Features
Core processor of PXA270 Flash size of 64MB Speed of 416MHz
CENGPXA270-416-10-550EIR Applications
There are a lot of Logic CENGPXA270-416-10-550EIR Microcontroller, Microprocessor, FPGA Modules applications.