CENGPXA270-416-10-550HIR datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Logic stock available on our website
SOT-23
CENGPXA270-416-10-550HIR Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Operating Temperature
-40°C~85°C
Published
2007
Size / Dimension
2.37 x 2.67 60.2mmx67.8mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Connector Type
SO-DIMM-144
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Frequency
416MHz
Speed
416MHz
RAM Size
64MB
Core Processor
PXA270
Module/Board Type
MCU Core
Flash Size
64MB
RoHS Status
RoHS Compliant
Lead Free
Lead Free
CENGPXA270-416-10-550HIR Product Details
CENGPXA270-416-10-550HIR Overview
A MCU Core module or board is used in the microcontroller.A PXA270-core processor drives microprocessor chip.The microcontroller is set to -40°C~85°C by default, which is the default setting.MCU chips flash size is 64MB.There are two types of connectors. The first is SO-DIMM-144.As a result, the RAM size of the software has been reduced to 64MB in order to ensure that MCU chip runs normally.MCU chips of the MCU chip are operated at a 416MHz speed.MCU chip can continue to function accurately at 416MHz frequency.At this time, 85°C is the maximum operational temperature.Microprocessor should be warmer than -40°C when operating.
CENGPXA270-416-10-550HIR Features
Core processor of PXA270 Flash size of 64MB Speed of 416MHz
CENGPXA270-416-10-550HIR Applications
There are a lot of Logic CENGPXA270-416-10-550HIR Microcontroller, Microprocessor, FPGA Modules applications.