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EP3SL50F484I4G

EP3SL50F484I4G

EP3SL50F484I4G

Intel

FPGAs Stratix? III L Series 484-BBGA, FCBGA

SOT-23

EP3SL50F484I4G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 484-BBGA, FCBGA
Operating Temperature-40°C~100°C TJ
Series Stratix® III L
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.86V~1.15V
Number of I/O 296
Number of Logic Elements/Cells 47500
Total RAM Bits 2184192
Number of LABs/CLBs 1900
RoHS StatusRoHS Compliant
In-Stock:1651 items

EP3SL50F484I4G Product Details

EP3SL50F484I4G Overview


Fpga chips is supplied in the 484-BBGA, FCBGA package. The I/Os are designed to facilitate a more coherent transfer of data. In order to construct a fundamental building block, 47500 logic elements/cells are required. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates wFpga chipsh a supply voltage of 0.86V~1.15V. As part of the Stratix? III L series of FPGAs, it is a type of FPGA. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 2184192 bFpga chipss. A total of 1900 LABs/CLBs make up this FPGA array.

EP3SL50F484I4G Features


296 I/Os
Up to 2184192 RAM bits

EP3SL50F484I4G Applications


There are a lot of Intel EP3SL50F484I4G FPGAs applications.

  • Data center hardware accelerators
  • Medical ultrasounds
  • Camera time adjustments
  • Software-defined radio
  • Data Mining
  • Broadcast
  • Voice recognition
  • Solar Energy
  • Cryptography
  • Bioinformatics

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