EP3SL70F484I3G Overview

There is a 484-BBGA, FCBGA package that includes this component. A total of 296 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block contains 67500 logic elements or cells. With a Surface Mount connector, this FPGA module can be attached to the development board. Fpga chips operates at a voltage of 0.86V~1.15V and uses a battery to supply power. An FPGA belonging to the Stratix? III L series is referred to as an FPGA. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. As a space-saving measure, this FPGA model is contained within Tray. Fpga electronics is worth mentioning that this device provides 2699264 bfpga electronics s of RAM. 2700 LABs and CLBs are built into this FPGA. Device package 484-FBGA (23x23) is provided by its supplier.

EP3SL70F484I3G Features

296 I/Os
Up to 2699264 RAM bits

EP3SL70F484I3G Applications

There are a lot of Intel EP3SL70F484I3G FPGAs applications.

• Device controllers
• Software-defined radios
• Wireless Communications
• Medical Electronics
• Image processing
• Distributed Monetary Systems
• Integrating multiple SPLDs
• Video & Image Processing
• Data Center
• Consumer Electronics