3/3.3V V MX29LV 32 Pin Memory IC MX29LV Series 12.4mm mm
SOT-23
MX29LV040CT2I-90G Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mounting Type
Surface Mount
Package / Case
32-TFSOP (0.724, 18.40mm Width)
Surface Mount
YES
Number of Pins
32
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
MX29LV
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
32
ECCN Code
EAR99
Technology
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
0.5mm
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Pin Count
32
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
4Mb 512K x 8
Memory Type
Non-Volatile
Operating Mode
ASYNCHRONOUS
Supply Current-Max
0.03mA
Memory Format
FLASH
Memory Interface
Parallel
Organization
512KX8
Memory Width
8
Write Cycle Time - Word, Page
90ns
Standby Current-Max
0.000005A
Memory Density
4194304 bit
Access Time (Max)
90 ns
Programming Voltage
3V
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
8
Sector Size
64K
Common Flash Interface
YES
Height Seated (Max)
1.2mm
Length
12.4mm
Width
8mm
RoHS Status
ROHS3 Compliant
MX29LV040CT2I-90G Product Details
MX29LV040CT2I-90G Overview
Non-Volatile is the type of memory it has. It is supplied votage within Tray. The file is embedded in a 32-TFSOP (0.724, 18.40mm Width) case. It is estimated that the memory size on the chip is 4Mb 512K x 8. This device uses takes advantage of the FLASH format. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -40°C~85°C TA. It is capable of handling a voltage supply of 2.7V~3.6V. The recommended mounting type for this device is Surface Mount. On the chip, there are 32 terminations. The comprehensive working procedure of this part involves 1 functions. The memory device designed for this application has been designed to be powered by an 3V power supply. There are 32 pins on the package of the memory device. I have noticed that the memory device has 32 pins, which indicates that it has 32 locations in the memory. Talking about power supplies, this memory chip requires merely 3/3.3V. This part plays an important role in applications that target the MX29LV series of memory devices. The device is able to run from a max supply current of 0.03mA , so it can be used in any environment. 3V programming voltage is required to change the state of certain nonvolatile memory arrays. As a result, this memory has 8 specific divisions of varying sizes.