MB89637PF-GT-1308-BND

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Manufacturer part number:MB89637PF-GT-1308-BND

Manufacturer:Cypress Semiconductor Corp

Description:32KB 32K x 8 Mask ROM F2MC-8L 8-Bit Microcontroller F2MC-8L MB89630 Series 64 Pin 10MHz 64-BQFP

Case Package:SOT-23

Datasheet:MB89637PF-GT-1308-BND Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	13 Weeks
Mounting Type	Surface Mount
Package / Case	64-BQFP
Number of Pins	64
Supplier Device Package	64-QFP (14x20)
Operating Temperature	-40°C~85°C TA
Packaging	Tray
Series	F2MC-8L MB89630
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Max Operating Temperature	85°C
Min Operating Temperature	-40°C
Frequency	10MHz
Interface	EBI/EMI, Serial, UART, USART
Memory Size	32kB
Oscillator Type	External
Number of I/O	53
Speed	10MHz
RAM Size	1K x 8
Memory Type	Mask ROM
Voltage - Supply (Vcc/Vdd)	2.2V~6V
Core Processor	F2MC-8L
Peripherals	POR, PWM, WDT
Program Memory Type	Mask ROM
Core Size	8-Bit
Program Memory Size	32KB 32K x 8
Connectivity	EBI/EMI, Serial I/O, UART/USART
Data Converter	A/D 8x10b
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
66	$19.50000	$1287

MB89637PF-GT-1308-BND Overview

In a 64-BQFP package, the MCU is available. 53 I/Os are available. The Microcontroller has a mounting type of Surface Mount, which indicates that it is mounted conveniently. The 8-Bit core is the core of the MCU. There is a Mask ROM type of memory for its program. There is a temperature range of -40°C~85°C TA that is operated by this Microcontroller. F2MC-8L MB89630 series components make up this electrical component. 32KB 32K x 8 is the size of its program memory. A F2MC-8L Core processor is used to power the device. 32kB is the memory size of the part. The efficiency of this device can be improved when operating at a frequency of 10MHz. Located on the chip are 64 pins. It has built-in Mask ROM memory.