1.8/3.33/3.3V V GL-P Memory IC GL-P Series 13mm mm
SOT-23
S29GL256P11FFIV22 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mounting Type
Surface Mount
Package / Case
64-LBGA
Surface Mount
YES
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Series
GL-P
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
1.65V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.33/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
256Mb 32M x 8
Memory Type
Non-Volatile
Operating Mode
ASYNCHRONOUS
Supply Current-Max
0.11mA
Memory Format
FLASH
Memory Interface
Parallel
Organization
256MX1
Memory Width
1
Write Cycle Time - Word, Page
110ns
Standby Current-Max
0.000005A
Memory Density
268435456 bit
Access Time (Max)
110 ns
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
256
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Width
11mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
400
$6.37900
$2551.6
S29GL256P11FFIV22 Product Details
S29GL256P11FFIV22 Overview
There is a Non-Volatile memory type associated with this device. The case comes in the Tape & Reel (TR) style. In the case of 64-LBGA, it is embedded within the case. It is estimated that the memory size on the chip is 256Mb 32M x 8. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. A wide operating temperature range makes this device ideal for a variety of demanding applications. A supply voltage of 1.65V~3.6V can be applied to it. As far as the mounting type is concerned, Surface Mount is recommended. It is planted on the chip with 64 terminations. The comprehensive working procedure of this part involves 1 functions. An 3V supply is required for this ic memory chip to operate properly. The memory device is enclosed in a package with an 64-pin connector. There is only a single power supply required for this memory chip. Its target applications rely heavily on the GL-P series memory devices. In order for it to operate properly, memory ics requires a maximum supply current of 0.11mA . Nonvolatile memory arrays require 3V programming voltage to change their state. As a result, this memory has 256 specific divisions of varying sizes.
S29GL256P11FFIV22 Features
Package / Case: 64-LBGA 64 Pins
S29GL256P11FFIV22 Applications
There are a lot of Cypress Semiconductor Corp S29GL256P11FFIV22 Memory applications.