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S29GL256P11FFIV22

S29GL256P11FFIV22

S29GL256P11FFIV22

Cypress Semiconductor Corp

1.8/3.33/3.3V V GL-P Memory IC GL-P Series 13mm mm

SOT-23

S29GL256P11FFIV22 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 64-LBGA
Surface Mount YES
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Series GL-P
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 1.65V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 40
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.33/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 256Mb 32M x 8
Memory Type Non-Volatile
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.11mA
Memory Format FLASH
Memory Interface Parallel
Organization 256MX1
Memory Width 1
Write Cycle Time - Word, Page 110ns
Standby Current-Max 0.000005A
Memory Density 268435456 bit
Access Time (Max) 110 ns
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 256
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Width 11mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
400 $6.37900 $2551.6
S29GL256P11FFIV22 Product Details

S29GL256P11FFIV22 Overview


There is a Non-Volatile memory type associated with this device. The case comes in the Tape & Reel (TR) style. In the case of 64-LBGA, it is embedded within the case. It is estimated that the memory size on the chip is 256Mb 32M x 8. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. A wide operating temperature range makes this device ideal for a variety of demanding applications. A supply voltage of 1.65V~3.6V can be applied to it. As far as the mounting type is concerned, Surface Mount is recommended. It is planted on the chip with 64 terminations. The comprehensive working procedure of this part involves 1 functions. An 3V supply is required for this ic memory chip to operate properly. The memory device is enclosed in a package with an 64-pin connector. There is only a single power supply required for this memory chip. Its target applications rely heavily on the GL-P series memory devices. In order for it to operate properly, memory ics requires a maximum supply current of 0.11mA . Nonvolatile memory arrays require 3V programming voltage to change their state. As a result, this memory has 256 specific divisions of varying sizes.

S29GL256P11FFIV22 Features


Package / Case: 64-LBGA
64 Pins

S29GL256P11FFIV22 Applications


There are a lot of Cypress Semiconductor Corp S29GL256P11FFIV22 Memory applications.

  • supercomputers
  • mainframes
  • printers
  • cell phones
  • graphics card
  • networking
  • multimedia computers
  • DVD disk buffer
  • hard disk drive (HDD)
  • eSRAM

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