3/3.3V V GL-P Memory IC GL-P Series 512 Mb kb 13mm mm
SOT-23
S29GL512P11FAI012 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
64-LBGA
Surface Mount
YES
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2015
Series
GL-P
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.B.1.A
Terminal Finish
Tin/Lead (Sn/Pb)
HTS Code
8542.32.00.51
Technology
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
240
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
30
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
512Mb 32M x 16
Memory Type
Non-Volatile
Supply Current-Max
0.11mA
Memory Format
FLASH
Memory Interface
Parallel
Organization
512MX1
Memory Width
1
Write Cycle Time - Word, Page
110ns
Density
512 Mb
Standby Current-Max
0.000005A
Access Time (Max)
110 ns
Programming Voltage
3V
Alternate Memory Width
8
Data Polling
YES
Toggle Bit
YES
Command User Interface
YES
Number of Sectors/Size
512
Sector Size
128K
Page Size
8/16words
Ready/Busy
YES
Common Flash Interface
YES
Height Seated (Max)
1.4mm
Length
13mm
Width
11mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
S29GL512P11FAI012 Product Details
S29GL512P11FAI012 Overview
As far as its memory type goes, it falls into the Non-Volatile category. There is a Tape & Reel (TR) case available. 64-LBGA case encloses it. The memory size of the chip is 512Mb 32M x 16 Mb. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. With 2.7V~3.6V as the supply voltage, it is capable of handling memory ics. As far as the mounting type is concerned, Surface Mount is recommended. It is planted on the chip with 64 terminations. It supports up to 1 functions for comprehensive operation. The memory device designed for this application has been designed to be powered by an 3V power supply. This memory device is enclosed in a 64-pin package. This memory chip requires a mere 3/3.3V of power. GL-P series memory devices play an important role in the applications they target. The device is able to run from a max supply current of 0.11mA , so it can be used in any environment. Nonvolatile memory arrays require 3V programming voltages to change their states. A total of 512 specifically sized divisions are contained in this memory.
S29GL512P11FAI012 Features
Package / Case: 64-LBGA 64 Pins
S29GL512P11FAI012 Applications
There are a lot of Cypress Semiconductor Corp S29GL512P11FAI012 Memory applications.