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S29GL512P11FAI012

S29GL512P11FAI012

S29GL512P11FAI012

Cypress Semiconductor Corp

3/3.3V V GL-P Memory IC GL-P Series 512 Mb kb 13mm mm

SOT-23

S29GL512P11FAI012 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 64-LBGA
Surface Mount YES
Number of Pins 64
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2015
Series GL-P
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 30
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 512Mb 32M x 16
Memory Type Non-Volatile
Supply Current-Max 0.11mA
Memory Format FLASH
Memory Interface Parallel
Organization 512MX1
Memory Width 1
Write Cycle Time - Word, Page 110ns
Density 512 Mb
Standby Current-Max 0.000005A
Access Time (Max) 110 ns
Programming Voltage 3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 512
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Width 11mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
S29GL512P11FAI012 Product Details

S29GL512P11FAI012 Overview


As far as its memory type goes, it falls into the Non-Volatile category. There is a Tape & Reel (TR) case available. 64-LBGA case encloses it. The memory size of the chip is 512Mb 32M x 16 Mb. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. With 2.7V~3.6V as the supply voltage, it is capable of handling memory ics. As far as the mounting type is concerned, Surface Mount is recommended. It is planted on the chip with 64 terminations. It supports up to 1 functions for comprehensive operation. The memory device designed for this application has been designed to be powered by an 3V power supply. This memory device is enclosed in a 64-pin package. This memory chip requires a mere 3/3.3V of power. GL-P series memory devices play an important role in the applications they target. The device is able to run from a max supply current of 0.11mA , so it can be used in any environment. Nonvolatile memory arrays require 3V programming voltages to change their states. A total of 512 specifically sized divisions are contained in this memory.

S29GL512P11FAI012 Features


Package / Case: 64-LBGA
64 Pins

S29GL512P11FAI012 Applications


There are a lot of Cypress Semiconductor Corp S29GL512P11FAI012 Memory applications.

  • graphics card
  • eSRAM
  • personal computers
  • multimedia computers
  • cell phones
  • hard disk drive (HDD)
  • mainframes
  • eDRAM
  • supercomputers
  • workstations,

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